SBIR-STTR Award

The objective of this Small Business Innovative Research (SBIR) Program is to develop a methodology to use novel multi-power sources for heater-on-circuit and cooling-on-circuit techniques in MicroElectroMechanical Systems (MEMS) packaging. This concept of multi-power sources, which includes alternative current heating, and the heater-on-circuit are new in MEMS packaging. While most MEMS packaging processes are performed under global heating, a local heating technique is required and often critical to widen the packaging operation temperature window and protect temperature-sensitive circuits. Conversly micro heat pumpng technology is needed to remorve heat or creat a stable ambient. These problems are related and of current importants for a large number of MEMS systems from sensors to microfuel cells. The research of this SBIR Program into multi-power heating/cooling takes advantage of this and will overcome the limitations of each single power source, thus providing an opportunity to develop a general MEMS packaging technology and platform for a wide range of materials, bonding mechanisms and applications

The objective of this Small Business Innovative Research (SBIR) Phase II program is to build on the methodology developed in our Phase I SBIR for the development of multi-power heater on-circuit and cooling on-circuit systems in Micro Electro Mechanical Systems (MEMS) packaging. This concept of multi-power sources, which includes alternative current heating, and the heater on-circuit are new in MEMS packaging. While most MEMS packaging processes are preformed under global heating, a local heating technique is required and often critical to widen the packaging operation temperature window and protect temperature sensitive surfaces. Conversely, micro-heat pumping technology is needed to remove heat or create a stable ambient. These problems are related and are of current importance for a large number of MEMS systems from sensors to micro fuel cells. The SBIR Phase I developed the design and tested key components for a smart packaging system which includes, micro heater and alternative ultraviolet (UV) package sealing system with integrated wireless power and communication. The SBIR Phase II will implement the design and components into a field testable prototype. As the prototype test platform, we have chosen a critical MEMS cluster array for smart package implementation for use in automotive or combat vehicles.

Keywords:
MEMS, Microsystems, Packaging, Micro-heating, Micro-cooling, Sensors, Micro Power-Systems