We propose the development of very low loss multi-throw MEMS switches for DC to mm-wave applications. The novel switches exhibit a loss of 0.1-0.2 dB from 0.1-50 GHz, and are used in true-time delay and constant-phase 2-bit, 3-bit and N-bit phase shifters. We also plan to partner with consultants at Microassembly, Inc., to develop a hermetic packaging technique for MEMS switches and phase shifters. The hermetic package is compatible with RF MEMS and will allow the integration of input and output lines through the wafer. The combined effort should lead to a novel and packaged phase shifters for X-band to mm-wave operation. We believe that the SBIR proposal effort will help in the commercialization of MEMS-based switches and phase shifters if the packaging aspect is solved. Other than the DOD applications and systems, the largest market will be the mobile telephone suppliers, since such a switch results in excellent performance (0.1 dB insertion loss) and can be used after the power amplifier in the transmit path. It also can be used before and after the switched filter bank in tri-band telephones. This is the reason why it is important to develop a packaging technology which is compatible with RF MEMS, and which can be done at a wafer-scale level.
