During Phase I of the U.S. Army SBIR program on Advanced Composite Solders for Microelectronics, HPM, Inc. successfully demonstrated the feasibility of producing by induction melting and inert gas atomization conventional 63Sn-37Pb solder powders and dispersion strengthened Tin-Lead solder alloys and composites with desired powdered characteristics and significant improvements in room and elevated temperature strength, creep resistance and fatigue life over conventional solders. The proposed Phase II program is to define the manufacturing parameters critical to process control, develop a large scale commercial powder plant for the production of high performance solders, implement quality control inspection techniques for producing composite solders and demonstrate a computer model of the composite solder matrix to allow transition of technology to MIL-STD-2000 soldering standards. 100-500 lb. batches of Sn-Pb-X (X-Cu, Ni, Ag, Sb, In, Bi) and lead free Sn-Ag solder alloys will be produced by induction melting/gas atomization, consolidated by hot isostatic pressing, and extruded to rods. Solder powders as well as bulk solders will be evaluated for microstructures, mechanical properties, and solderability by HPM, Inc., as well as by the potential customers. A business plan for commercialization of the product during Phase III will be prepared.
