With the increasing demand on structural performance as well as decreasing size and weight of advanced flying structures, there is a reduction in the available volume for aircraft instrumentation. In addition, integral fabrication of structures using composite materials and close integration and optimization of aircraft system and subsystems limit further access and space for sensors, wiring, and instrumentation. This situation becomes more critical during aircraft Testing and Evaluation (T&E) phases than during service phase. In order to assess how new flying systems perform during T&E, new technologies and approaches are needed to monitor aircraft loads and structural responses during different flight stages and missions. Some ways to reach this goal is by using additive manufacturing techniques. Additive manufacturing for structural components are becoming popular not only in daily use products but also are becoming an alternative to fabricate high performance structures. In parallel, printed electronics technologies are being transitioned from Lab systems into real life applications from consumer electronics to solar panels and to sensing/acting networks for example. The use of different inks (conductors, semiconductors, and dielectrics for example) can be used to produce highly multifunctional structures that are few microns thick. Typical elements or components are interconnects, electrodes, heaters, sensors (pressure, temperature, strain), transducers, antennas and coatings for example. It is clear that by combining both additive processes, a new revolution on how we design, fabricate, testing, and maintain products and systems will occur. As a result, really true multifunctional, smart, and lightweight devices and system will be able to be created and used for T&E on USAF structures.
Benefits: The successful development of the pSKIN system described within this proposal will enhance T&E for advanced USAF platforms and can be retrofit on current and legacy flying vehicles. In addition, the ability to deposit or print pSKIN sensing network on any type of surface or geometry will allow the use of SHM and embedded sensors at affordable prices on different types of structures. Further, the data provided by the proposed system can be used to manage better the aircraft assess, and to define remedial strategies before the structural gets into service. This will improve the safety and reliability of the USAF equipment by detecting, monitoring, and managing performance before the system is transfer to service. In addition, pSKIN offers the opportunity to enhance laminar flow control and reducing drag on future aerodynamic configurations.
Keywords: Printed Electronics, 3D Printing, Additive Manufacturing, Pressure, Strain, Temperature
