
Ultradense Plasmonic Integrated Devices and CircuitsAward last edited on: 1/6/2011
Sponsored Program
STTRAwarding Agency
DOD : AFTotal Award Amount
$100,000Award Phase
1Solicitation Topic Code
AF08-BT18Principal Investigator
Salah KhodjaCompany Information
Phase I
Contract Number: ----------Start Date: ---- Completed: ----
Phase I year
2010Phase I Amount
$100,000Benefit:
Anticipated development of the proposed plasmonic integrated devices and circuits concept will be of immediate use where conventional optical devices has been prohibited by the optical diffraction limit. This technology is critical to the success of nanoscale optical interconnect compatible with electronic circuitry. The proposed metallic nanostructures will find application in low power integrated photonic devices and similar structures may be used for compact switching, and modulation. When brought to product, some of the commercial applications that will benefit directly from the use of this technology are high frequency optical clock distribution, large scale optical interconnect, remote vehicles etc, in which high reliability and EMI are key factors to the overall success of the product. Commercial application are driven by the rapid increase in the clock speed of computers has slowed in recent years due to the interconnect bottlenecks on the chip itself. A plasmonic architecture is expected to alleviate the problems associated with the large size of present day optical components. In the near term, for applications not requiring an entire plasmonic ensemble of waveguides, sources, detectors, and devices, individual advances in plasmonic devices will help to couple photonics to the rapidly developing field of nanotechnology.
Keywords:
Metallic Nanostructures, Plasmon Waveguides, Signal Processing, Photonic Integration, Optical Processors, Nanotechnology, Plasmonics, Nanofabrication.
Phase II
Contract Number: ----------Start Date: ---- Completed: ----