We are developing flexible integrated portable power (FIPP), which consists of flexible photovoltaics (PV), flexible battery storage layer, and an attached charge control circuitry. Ideally, these components are monolithically integrated, that is, all electrical interconnects are made during processing and do not require subsequent soldering; this requires an electrically insulated substrate. While our production goal for flexible PV is between 8-10% efficiency, an electrically insulated substratecapable of surviving higher temperatures would allow for monolithically integrated module with efficiencies between 10% and 15%. Likewise, we are developing flexible thin-film batteries with the ability to withstand 10,000-40,000 charge cycles and demonstrate high power density. Unfortunately, processing temperatures of these batteries is 700 (degrees)C, thereby eliminating polyimide substrates and, thus, monolithic integration. The goal of this program is to take a normally-conductive substrate, such as a metal foil, and coat it with an insulating film that can survive both processing temperatures up to 700 (degrees)C, as well as laser scribing. We will use innovative Atomic Layer Deposition and anodization, both independently and in combination, to provide a high-temperature substrate for both the PV and battery. Thus, we can provide a completely integrated power generation and storage component for microsatellite "off the shelf" power systems