We propose high-performance heat sinks based on MEMS technology for cooling of advanced electronics. Our approach combines innovative designs, new microfabrication techniques, and high conductance materials resulting in extremely low thermal resistance and high heat load capacities in a compact and cost effective design, By using MEMS batch fabrication, the heat sinks can be made inexpensively, especially compared with complex forced liquid convention cooling systems made by conventional means. Furthermore, MEMS-based heat sinks will be smaller, lighter, and more amenable to incorporation into dense and space limited electronics systems than conventional heat sink technology. Opportunities exist for both passive and active cooling systems, in military and commercial electronics applications.
Benefits: The proposed heat sink technology will be applicable to advanced military applications including future high temperature eletronics applications. There are substantial commercial applications with large markets in electronics cooling, including personal computers and laptops where MEMS technology can provide enhanced performance with size, weight, cost, and reliability improvements.
