SBIR-STTR Award

Development of Affordable Integrated Optic Chips
Award last edited on: 9/25/02

Sponsored Program
SBIR
Awarding Agency
DOD : AF
Total Award Amount
$788,916
Award Phase
2
Solicitation Topic Code
AF96-179
Principal Investigator
Amaresh Mahapatra

Company Information

Ramar Corporation

71 Lyman Street
Northborough, MA 01532
   (508) 393-4225
   N/A
   N/A
Location: Single
Congr. District: 02
County: Worcester

Phase I

Contract Number: F33615-96-C-5625
Start Date: 4/26/96    Completed: 2/26/97
Phase I year
1996
Phase I Amount
$76,933
The goal of this proposal is to develop manufacturing technolgies for fiber pigtailed lithium niobate IOCs for Interferometric Fiber Optic Gyros (IFOG) that will reduce unit cost to $100. The opportunity here is to develop a manufacturing technology that will enable the economic, large scale use of IOCs not only for IFOGs but also for other commercial applications such as CATV, optical sensors for the utility, chemical and medical industry, and high data rate communications for deployment in the Information Highway. This proposal will look specifically at the following stages in the fabrication of IOCs: Wafer/chip manufacturing, Chip end preparation, Fiber preparation, Fiber chip attachment, and packaging. We will develop a novel active fiber alignment technique to achieve 50 dB polarization extinction and a single step cut and polish method for IOC and fiber endface preparation.

Phase II

Contract Number: F33615-97-C-5124
Start Date: 5/6/97    Completed: 6/6/99
Phase II year
1997
Phase II Amount
$711,983
The goal of this proposal is to develop manufacturing technolgies for fiber pigtailed lithium niobate IOCs for Interferometric Fiber Optic Gyros (IFOG) that will reduce unit cost to $100. The opportunity here is to develop a manufacturing technology that will enable the economic, large scale use of IOCs not only for IFOGs but also for other commercial applications such as CATV, optical sensors for the utility, chemical and medical industry, and high data rate communications for deployment in the Information Highway. This proposal will look specifically at the following stages in the fabrication of IOCs: Wafer/chip manufacturing, Chip end preparation, Fiber preparation, Fiber chip attachment, and packaging We will develop a novel active fiber alignment technique to achieve 50 dB polarization extinction and a single step cut and polish method for IOC and fiber endface preparation