Wafer probing is the critical link between wafer fabrication, and device packaging or hybrid subsystem insertion. For GaAs MMICS to be cost effective, they must be tested in a manner that is reliable, fast, and efficient. This proposal describes a program to develop equipment and techniques for high rate, high volume MMIC wafer probing. Phase I of this program will include an experiment using existing equipment and MMICS, and research to define the present state-of-the-art, to identify those areas which must be approached. Hardware compatible with accurate, high-speed microwave testing, and techniques for interfacing this equipment to MMICS on-wafer will be investigated. Reducing the cost of the final MMIC device by effective sorting of die is the primary objective of this work.
