The objective of the program is to combine the high reliability, stable, laser and packaging technology developed for telecommunications applications with the high frequency (20 ghz) wafer chip design and packaging required for analog microwave frequency applications. We will I) design and have made masks for production of short cavity restricted area contact laser. Ii) grow, process mount and bond de vices from two wafers using the above masks. Iii) measure the capacitance and swept frequency response of these devices. Iv) analyze previous lifetest data to determine effect of high power operation on reliability. Mount, bond, burn in, and evaluate 1000 hour, 80 deg C operation of short cavity restricted area lasers de scribed above. V) construct a prototype breadboard module incorporating microwave stripline and laser welding of the fiber, and characterize the swept frequency performance of this module. Vi) incorporate 35um detector in the lasertron UHS (ultra-high-speed) detector module. The overall result of this phase I effort will be confirmation that the present commercial ... Laser manufactured by lasertron in volumes exceeding 1000/week to stringent reliability requirements can be adapted for use at 20 ghz, and that the high stability laser welded packaging developed for telecommunication applications can be modified to accept microwave stripline components.
