Photoelectron emission (PE) techniques along with a few other nde techniques including, ultrasonics (UT), are considered for prebond inspection of materials in manufacturing as well as field environment. A plan is proposed to demonstrate the feasibility of using PE for prebond inspection of materials which includes correlation of PE parameters with bond quality parameters. Such a relationship is also planned for testing other various NDE techniques and their potential in controlling, predicting, or assuring bond quality. A comparison of PE results with that of other NDE techniques is planned. A limited amount of thermal acoustic wave imaging and photoacoustic imaging is proposed for review purposes. It is anticipated that the literature review and the results of this study will provide a data base and a strong foundation for developing a portable, simple NDE technique that could be used for depot or field inspection of prepared surfaces of 100% qualification prior to bonding. The navy, general dynamics, Boeing and Hughes aircraft will provide cooperation in sample preparation based on standard surface preparation specifications and in gathering unpublished data on prebond inspection methods.
