
Sensant Corporation Profile last edited on: 5/24/2016
CAGE: 1KS59
UEI: NVP7MNALDM71
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Location Information
Location: Single
Congr. District: 13
County: Alameda
Congr. District: 13
County: Alameda
Public Profile
In June 2005 Sensant Corporation was acquired by the German Medical giant Siemens AG. Combining the benefits of state-of-the-art MEMS (Micro Electro Mechanical Systems) technology with the potential of on-chip electronics, Sensant's Silicon Ultrasound(tm) transducers deliver revolutionary improvements in performance and cost and represent a major advance in ultrasonic sensing. Using a technique known as surface micromachining, Sensant's transducers are built on the surface of silicon wafer and resemble tiny percussion drums. When these drums are beatenelectronically, they generate high-frequency sound waves. Conversely, when sound waves impinge upon the drums, they vibrate the drum membrane and produce a received electrical signal. Sensant has designed air and immersion transducers using its advanced MEMS technology. These transducers are suitable for one and two-dimensional arrays and offer superior bandwidth, high frequencies, small size and volume pricing. And because these transducers are made on a silicon wafer, integration with semiconductor electronics is possible, thereby opening up exciting new opportunities
Extent of SBIR involvement
Synopsis: Awardee Business Condition
Employee Range
10-14Revenue Range
1M-1.5MVC funded?
YesPublic/Private
Privately HeldStock Info
----IP Holdings
10-14Awards Distribution by Agency
Most Recent SBIR Projects
Year | Phase | Agency | Total Amount | |
---|---|---|---|---|
2003 | 2 | NSF | $599,880 | |
Project Title: Investigation of Charge Trapping in Plasma Enhanced Chemical Vapor Deposition (PECVD) Dielectrics Using Electrostatically Actuated Mechanical Resonators | ||||
2003 | 2 | DARPA | $881,982 | |
Project Title: Virtual Ultrasound Transducer Control for Telemedicine, An Application of Flexible MEMS Arrays | ||||
2002 | 1 | NSF | $99,998 | |
Project Title: Investigation of Charge Trapping in Plasma Enhanced Chemical Vapor Deposition (PECVD) Dielectrics Using Electrostatically Actuated Mechanical Resonators | ||||
2000 | 2 | Navy | $492,187 | |
Project Title: MEMS Sensors for Large Area Hidden Corrosion Detection |
Key People / Management
Alissa Fitzgerald
Gerg Johnson
Gerg Johnson
Company News
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