SBIR-STTR Award

Measurement of Angular Valve Displacement in High Vibration Environments
Award last edited on: 4/1/2008

Sponsored Program
SBIR
Awarding Agency
DOD : AF
Total Award Amount
$99,898
Award Phase
1
Solicitation Topic Code
AF04-291
Principal Investigator
Richard J Casler

Company Information

Picosys Inc (AKA: Invenios Inc)

320 North Nopal Street
Santa Barbara, CA 93103
   (805) 962-3333
   N/A
   www.invenios.com
Location: Single
Congr. District: 24
County: Santa Barbara

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2004
Phase I Amount
$99,898
The United States Air Force (USAF) is experiencing high failure rates in valve position transducers that are employed in many of its testing facilities. The transducers are subjected to extreme levels of vibration-in excess of 50 gRMS over the 0-10,000 Hz band; a wide operating temperature range from -10°F to 140 °F; and other environmental influences including moisture, dirt and other contaminants. The USAF seeks a robust transducer design that can operate within these broad environmental conditions and deliver a resolution of 0.1% of maximum valve travel (~90°) with a response time of 10 milliseconds. In Phase I, Invenios, Inc. proposes to develop a retrofittable eddy current-based absolute position transducer that derives position in a Readhead that senses coil inductance variations, in quadrature, on two separate tracks of different pitch as a slotted metallic code wheel rotates overhead. The Readhead integrates a digital signal processor onto a micromachined photostructurable glass-ceramic substrate-using proprietary technology that Invenios licensed from The Aerospace Corporation- that employs an array of high-aspect ratio coil grooves filled with conductive material. The result is a first-of-its kind, "chip encoder" that achieves the USAF requirements in the smallest possible footprint.

Keywords:
Eddy Current Position Sensing, Valve Position Transducer, Position Transducer For Extreme Environments, Absolute Position Transducer, "chip Encoder", High-Aspect Ratio Microma

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
----
Phase II Amount
----