Basic Electronics, Inc. has developed and patented a unique, composite material that provides significant potential for solving thermal problems and weight problems associated with current systems used to dissipate heat. This composite material conducts heat at rates of up to five times greater than that of copper and is approximately half the weight of aluminum. The purpose of this proposal is to demonstrate the performance of the thermal composite material in various configurations to resolve thermal management and weight problems in electronic systems.
Benefits: Properly configured, this composite material allows more efficient operation of increasingly miniaturized electronic systems and devices of all types. It also reduces weight in devices where excess weight is a performance constraint.
Keywords: Thermal Composite Material Thermal Management Electronic system weight reduction
