SBIR-STTR Award

A primary limitation to the implementation of new ground-based astronomy measurement techniques is the inaccuracy of navigation and targeting due to error in the celestial frame of reference. This celestial frame of reference is relied upon for satellite attitude determination, payload calibration, in-course missile adjustments, space surveillance, and accurate star positions used as fiducial points. The development of an ultrahigh resolution CCD (up to the limit of a 150 mm wafer) that integrates high dynamic range and fast readout will substantially decrease the error in the celestial reference frame. New developments within semiconductor fabrication, along with a mature CCD processing, will alleviate yield issues and improve cosmetic quality. New process technologies including high-k gate dielectrics, shallow trench isolation, chemical-mechanical processing, and combination stepper-scanner capabilities, aid in large area yield, improved charge transfer efficiency (CTE), fast readout, decreased RMS noise, and improved CCD sensitivity. Semiconductor Technology Associates proposes a solution which will identify and integrate the appropriate new semiconductor technology advancements to existing CCD processing recipes to yield large area ultrahigh resolution imager systems.

Keywords:
Ultrahigh Resolution, Yield, Noise, Dynamic Range, Charge Coupled Device, Camera

A primary limitation to the implementation of new ground-based astronomy measurement techniques is the inaccuracy of navigation and targeting due to error in the celestial frame of reference. This celestial frame of reference is relied upon for satellite attitude determination, payload calibration, in-course missile adjustments, space surveillance, and accurate star positions used as fiducial points. The development of an ultrahigh resolution CCD (up to the limit of a 150 mm wafer) that integrates high dynamic range and fast readout will substantially decrease the error in the celestial reference frame. In Phase I Semiconductor Technology Associates demonstrated the feasibility of a full 150mm wafer large format CCD imager. New semiconductor technology advancements were identified appropriate to existing CCD processing recipes to make possible high yield large area ultrahigh resolution imagers. In addition a preliminary design of the 10k x10k CCD has been completed. During Phase II, STA will fabricate, and demonstrate a prototype detector camera system with the required specifications. A final design will be produced following review of the Phase I work. A complete demonstration camera system will be assembled including dewar, software and electronics to evaluate the overall performance of the CCD on a telescope.

Keywords:
Ultrahigh Resolution, Yield, Noise, Dynamic Range, Charge Coupled Device, Camera