
Innovative Manufacturing Process ImprovementsAward last edited on: 7/19/2007
Sponsored Program
SBIRAwarding Agency
DOD : MDATotal Award Amount
$846,433Award Phase
2Solicitation Topic Code
MDA04-111Principal Investigator
Casey H CooperCompany Information
Soldering Technology International Inc (AKA: STI Electronics Inc)
Location: Single
Congr. District: 05
County: Madison
Congr. District: 05
County: Madison
Phase I
Contract Number: ----------Start Date: ---- Completed: ----
Phase I year
2005Phase I Amount
$96,732Phase II
Contract Number: ----------Start Date: ---- Completed: ----
Phase II year
2006Phase II Amount
$749,701Keywords:
Reliability, Reduced Weight, Thermal Management, Miniaturization, Smallest Form And Fit Factor, Reduced Size, Advanced Materials, Robustness