The objective of the Phase I SBIR program is to investigate the feasibility of using multi-power sources fro MEMS packaging, to over comeheating at the bonding the limitations of each single power source to allow localized heating at the bonding area without overheating temperature sensitive electronic circuitry and MEMS devices. Success from this program can lead to developing an advanced MEMS packaging technology and platform for a wide range of materials, bonding mechanisms and applications.
