
Thermal Spray Technologies Inc Profile last edited on: 6/12/2019
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Business Identifier: Metal coatings, HVOF and wear resistance coatings for thermal spray coating Is this YOUR Company?
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Location Information
Location: Multiple
Congr. District: 02
County: Dane
Congr. District: 02
County: Dane
Public Profile
Thermal Spray Technologies provides metal coatings, HVOF and wear resistance coatings for thermal spray coating needs. The firm's high velocity oxy-fuel, wear resistance and other flame spray applications can provide thermal barrier coatings for any industry usage. The idea for Thermal Spray Technologies, Inc. came through a graduate research program in the late 1980s at the University of Wisconsin-Madison, Department of Materials Science and Engineering, formally the Metallurgical Engineering Department. The notion was to use wear resistant coatings to make lawn mower blades last longer. The research undertaken studied different coating technologies including the technology of thermal spraying. Several different ideas for coatings were worked on such that by 1992 enough of the ideas had been commercialized that it made sense to separately incorporate Thermal Spray Technologies, Inc., (TST). Two years following the incorporation of TST, the company moved from sister company Fisher Bartons facility to its newly built home in Sun Prairie, Wisconsin. Four years later TST expanded its facility to over three times its original size. Today, TST innovation has developed coating solutions for many diverse applications for some of the worlds leading OEM manufacturers across a range of industries.
Extent of SBIR involvement
Synopsis: Awardee Business Condition
Employee Range
100-149Revenue Range
10M-15MVC funded?
NoPublic/Private
Privately HeldStock Info
----IP Holdings
1-4Awards Distribution by Agency
Most Recent SBIR Projects
Year | Phase | Agency | Total Amount | |
---|---|---|---|---|
1999 | 1 | EPA | $66,627 | |
Project Title: Development of Thermal Spray Circuit Board (TSCB) Technology To Replace Electroplating and "Print-and-Etch" Circuit Board Fabrication Techniques | ||||
1999 | 1 | DARPA | $74,114 | |
Project Title: Development of Thermal Spray Circuit Board (TSCB) Technology for Hybrid Circuits | ||||
1997 | 1 | AF | $90,370 | |
Project Title: Method Of Producing Advanced Printed Wiring Boards Using The Technology Of Thermal Spraying | ||||
1991 | 1 | Army | $49,600 | |
Project Title: High temperature, abradable coatings for turbine engine compressors |
Key People / Management
William J Lenling -- President
Daryl E Crawmer -- Director of Technology
Richard Stuntebeck
Richard Wilkey -- Former President
Daryl E Crawmer -- Director of Technology
Richard Stuntebeck
Richard Wilkey -- Former President
Company News
There are no news available.