Radiance proposes to develop a new opto-electronic packaging technology for optical space communication. The package will provide high-thermal dissipation, microwave-speed electrical connections, thermal expansion matched to GaAs, submicron alignment of optical components and hermetic, high-reliability packaging. This will be possible by the use of a novel low-cost composite substrate that combine unique properties that where until now considered mutually exclusive of each other. This, combined with an innovative use of low cost micro-optics will allow the package to use newly developed high-power, high-speed semiconductor laser sources and associated driver electronics which are prime candidates for high bit rate optical space communications. This technology will enable an order of magnitude reduction in package weight and size while increasing performance and reliability.
Potential Commercial Applications:The proposed package will represent a significant performance, cost and size advantage over conventional optoelectronic packages for high power and high speed optoelectronics. Applications include inter and intra satellite optical communications, laser sources for printing and data storage. It will also significantly lower the cost of high reliability packages of pump lasers used in Er -doped amplifiers for long-haul fiber telecommunications.
