We propose to develop a suite of PC and workstation computer programs (TCON) that tightly integrate thermal design and analysis procedures into the CAD/CAE/FEM fields, integrating the interfaces for thermal conduction and radiation analyses with each other and with these complementary disciplines. These procedures are significantly more accurate, user friendly and thorough than those currently available. Several innovations give TCON its advantages: (1) user-written input/output format files so the engineer can use his choice of graphical input system and of thermal analyzer; (2) thermal-model factors using the advanced technologies we developed for NASA for accurate thermal modeling; and (3) thermal-model simplification without loss of connectivity with other CAD/CAE models. TCON addresses directly NASA's 07.03 topic: accommodating data formats, including STEP, from different CAE software/hardware systems to produce an interface with thermal radiation, conduction and convection programs. NASA and US industry will benefit by the more accurate, more thorough models that will result with TCON, which can easily accommodate the latest input/output technologies.TCON will be sold to engineers, such as electronics-packaging and spacecraft engineers, who simulate the performance of temperature- control systems. Our anticipated price is less than 10% of that of our competitors because of our innovative approach. The low price gives small companies and consultants an heretofore unaffordable engineering capability.
Keywords: Phase_I, NASA, Abstract, FY94
