We have previously designed an inspection station implementing infrared detected thermal signatures for the monitoring of mechanical integrity of Tape Automated Bonded (TAB) interconnections. In this research we wish to apply various signal processing techniques to this design in order to evaluate the feasibility of using this modified work station to monitor the transmission line characteristics of the tab bonded interconnections. There is a need for this work station because much the escalating expense in the multichip module fabrication is brought on because of the inability to monitor the electrical qualities of the interconnections, such as impedance perturbations and discontinuities, and cross talk, when high quality electrical signals are required for reliable operation. The proposed work station is completely automated, and we will evaluate the feasibility of using signal processing techniques for obtaining real time measurements of the electrical characteristics at the inspection station. Anticipated benefits/potential commercial applications of the research or development. If this research is successfully completed we will be able to reduce fabrication costs of multichip modules up to eighty percent by implementing in-situ monitoring of the electrical characteristics while the modules are being assembled. These costs will be reduced by reduction of rework now required after electrical inspection.
