SBIR-STTR Award

  1. You are here:    Home
  2. Search Databases
  3. Search SBIR-STTR Awards
  4. SBIR-STTR Award

Fine line input/output interconnection of GaAs devices with tab bonding
Award last edited on: 6/14/2002

Sponsored Program
SBIR
Awarding Agency
DOD : AF
Total Award Amount
$49,500
Award Phase
1
Solicitation Topic Code
AF88-047
Principal Investigator
Robert J DeMaria

Company Information

TTL Techniques

65 Limekiln Place
Glenside, PA 19038
   (215) 641-0722
   N/A
   N/A
Location: Single
Congr. District: 04
County: Montgomery

Phase I

Contract Number: 19628-88-C-0137
Start Date: 7/28/1988    Completed: 00/00/00
Phase I year
1988
Phase I Amount
$49,500
Two tab "bumping" and two tab tape fabrication processes will be developed and evaluated. Also included in the evaluation will be a new tab lead design. These emerging technologies along with technologies growing out of previous microelectronics packaging s.B.I.R. Research programs will be integrated and evaluated per mil spec 883 testing. If successful, this project will also provide highly desirable packaging which may be implemented for high spec digital signal processing as well as one with excellent thermal management properties. Conventional microelectronics and printed circuit board technology is implemented helping to keep the proposed process cost effective.

Phase II

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
----
Phase II Amount
----