A new system for repair of high-density, surface-mounted devices was developed and demonstrated in Phase I of this SBIR program. The system provides a non-contact means of heating solder pads and terminals through the use of focused infrared energy. This proposal for the Phase II continuation of the program calls for refinement and semi-automation of the Phase I equipment, and the development of several additional features which are deemed desirable. Among these are a semi-automatic parts-handling system, a pre-heat system for substrates, and positive control of the temperature of the SMD solder leads under repair through feedback. Provisions for application of the equipment to commercial use will also be pursued.
