Development of a strategic radiation hardened FPGA with secure boot through MRAM. The FPGA will be demonstrated on state-of-the-practice foundry technology. The FPGA architecture will be developed to support a future port to state-of-the-art foundry technology. The FGPA will be architected to support a chiplet embodiment which will enable rapid reconfiguration of strategic rad hard FPGA products where the FPGA, MRAM, and data conversion chiplets are intergrated together in a single package.
Benefit: FPGA will be designed to operate through extreme radiation environments and will be fabricated using on-shore foundry technology. An MRAM non-volatile memory will contain the configuration code. The goal is to configure a system where the FPGA and MRAM are implemented as chilplet die so variations of products can be assembled to address specific application needs.
Keywords: system in package, system in package, Programmable Hardware, Strategic Radiation Hardened, FPGA, MRAM, Field Programmable Gate Array, reconfigurable, chiplet
