To enable the future needs of efficient computing for edge data centers, Flexnode and its partners, the University of Maryland (UMD), Boeing, Iceotope, SHoP Architects, and Arup, propose to develop a prefabricated modular micro data center with unprecedented energy efficiency and power density. The proposed system leverages four key component and system-level technology advancements: (a) a novel, experimentally proven, manifold microchannel heat sink technology that gives about three times higher heat removal rates at comparable pressure drops compared to the state-of-the-art technologies; (b) a chassis-based novel hybrid immersion cooling approach; (c) a low-cost, high-performance additive manufacturing-enabled dry cooling technology; and (d) a topology optimized container housing the entire system. These advancements will be achieved while meeting or exceeding the required performance, power density, cost, and sustainability metrics. The climate- and location-agnostic system will deliver a minimum power density of 20 kW/m3 within the volume of an ISO 40 shipping container. The total power consumption by heat rejection infrastructure and ancillary loads from the data center enclosure will not exceed 5% of the IT load. Sustainable design parameters include zero net water consumption, zero global warming potential (GWP), and zero ozone depletion potential (ODP) for all heat transfer fluids utilized. Deployment will be achievable shortly after delivery, only requiring an external power source and connectivity. System reliability will be engineered for at least 99.982% uptime. The proposed design will be cost-competitive with current state-of-the-art economic performance, including total system payback of under five years and a total system internal rate of return (IRR) of minimum 11%. Reliability will be optimized by leveraging reliability system engineering expertise currently in use in the data center, electronics manufacturing, and aerospace sectors. The Flexnode team comprises members with track records of success at marketing technological innovations and driving industry change, particularly in liquid cooling of electronic components, heat transfer, and modular prefabrication. Their expertise will be applied to the commercialization of the COOLERCHIPS modular micro data center.
