SBIR-STTR Award

Packaging Methods for Reliable and Scalable High Temperature Electronics
Award last edited on: 3/31/2023

Sponsored Program
SBIR
Awarding Agency
DOD : MDA
Total Award Amount
$154,949
Award Phase
1
Solicitation Topic Code
MDA22-008
Principal Investigator
Anthony Matt Francis

Company Information

Ozark Integrated Circuits Inc (AKA: Ozark IC )

700 West Research Center Boulevard
Fayetteville, AR 72701
   (479) 409-5201
   admin@ozarkic.com,info@ozarkic.com
   www.ozarkic.com
Location: Single
Congr. District: 03
County: Washingto

Phase I

Contract Number: HQ0860-22-C-7830
Start Date: 7/25/2022    Completed: 1/24/2023
Phase I year
2022
Phase I Amount
$154,949
In conjunction with the USAF, Ozark IC has developed packaging systems based on silicon (Si) and silicon-on-insulator (SOI) components for advanced control of turbine engines. A clear opportunity exists to evaluate and improve Ozark IC’s packaging systems, demonstrated from 200C to 800C for extreme vibration and shock to meet missile interceptor requirements. This can be accomplished through use of unique attachment materials and development of predicative models – based on measurement and characterization of these materials. The proposed systems also offer scalability in terms of manufacturing; they can utilize 3D printing systems for rapid prototyping, while using materials compatible with production methods for mass production. Approved for Public Release | 22-MDA-11215 (27 Jul 22)

Phase II

Contract Number: ----------
Start Date: 00/00/00    Completed: 00/00/00
Phase II year
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Phase II Amount
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