Phase II Amount
$1,150,000
Problem Statement: Terahertz radiation is emerging as a valuable portion of the electromagnetic spectrum for imaging with important applications in medicine, security, defense, manufacturing, scientific research, and is a leading technology for 6G wireless networking. The traditional multi-step lithography-based approach for manufacturing THz filters is expensive and limited to diameters of 30 cm. However, lower cost, high quality THz filters of arbitrary size are required for many applications, including the CMB-S4 program. How this Problem Will Be Addressed: The proposed technology is a rapid, low-cost fabrication method for multi-layer, metal-mesh THz filters that will produce these filters using a direct-write approach at a lower cost, in higher volumes, and with arbitrarily large diameters. What was Done in Phase I: The Phase I project experimentally demonstrated that this new fabrication technology has the ability to create the microstructures necessary for these filters and demonstrated a single-layer THz filter during the project. The fabrication technology can also create other structures, similar to the microstructures in THz filters, that are desired by potential industrial customers. What is Planned for the Phase II Project: The Phase II project will develop a complete large-area, nano-laser-ablation tool for filters along with supporting capabilities of filter design and testing to provide custom fabricated multi-level metal mesh filters for a variety of THz applications. Commercial Applications and Other Benefits If Carried Over to Phase II: Commercial applications for the proposed high-performance filters include THz imaging, spectroscopy, and wireless communications. These applications would benefit industries such as medicine, homeland security and defense, consumer devices, food safety, non-destructive evaluation for manufacturing, and scientific research. The nano-ablation capability will also be broadly useful as a rapid microfabrication tool that would be useful in microsystems, optics, integrated circuits, and circuit board production.