Spun out of research conducted at the Electrical and Computer Engineering Department of The Ohio State University, TeraProbes has developed a non-contact probing technology for high-speed electronics applications that can alleviate problems involving probe wear and tear, contact repeatability, and high hardware and operation costs associated with on-wafer device and integrated circuit (IC) characterization. Instead of making physical contact to launch and receive test signals, the firm uses highly-focused, high-frequency beams and tiny on-wafer antennas to eliminate the physical contact between the test system and the device under test. It specializes in Fully-automated Non-Contact On-wafer Probing Systems, High Frequency Antenna Design, and THz Characterization.
