SBIR-STTR Award

200Gb/s WDM Optical Transceiver Chip Modules with RF Transmission, Quadrature Modulation and Fail-Safe Capabilities
Award last edited on: 3/14/2019

Sponsored Program
SBIR
Awarding Agency
NASA : JPL
Total Award Amount
$122,136
Award Phase
1
Solicitation Topic Code
H9.01
Principal Investigator
Yingyan Huang

Company Information

OptoNet Inc

828 Davis Street Suite 206
Evanston, IL 60201
   (847) 425-7585
   info@optonetinc.com.
   www.optonetinc.com
Location: Single
Congr. District: 09
County: Cook

Phase I

Contract Number: ----------
Start Date: ----    Completed: ----
Phase I year
2016
Phase I Amount
$122,136
There have been significant interests from NASA in integrated optical transceiver chips for space optical communications, in particular space-qualifiable 1550nm laser transmitter and receiver with optoelectronic laser, modulator, and detector, that are capable of data rates from 1Gb/sec to 200Gb/sec. The power efficiency shall be better than 10W per Gb/sec and weight less than 100g per Gb/sec. In addition, hybrid RF-optical technologies are sought, and technology based on integrated photonic circuit solution is strongly desired.Operational range of -20� C to +50� C unpowered temperature cycling from -40� C to +40� C are also desired.To address the above mentioned interests, our proposed works will focus on realizing 100-200Gb/sec high-data-rate Wavelength-Division-Multiplexed (WDM) photonic transceiver module with the capability to transmit RF signals on optical beam as well that will be able to meet the above NASA requirements, based on a few key technologies we have developed including: (a) WDM Laser Transmitter with Concurrent Wavelength Locking Capability;(b) Ultra-Compact Wavelength Mux/DeMux; (c) Integrated Narrow Linewidth Laser;(d) Integrated 20-40Gb/sec High-Speed Electro-Optic Modulator with Low-Voltage Capability; (e) Polarization-Insensitive Multi-Mode-Fiber-Capable Integrated 100-200Gb/sec WDM Optical Receiver with Fail-Safe Wavelength and Power Recovery Capabilities; (f) Ruggedized Wide-Temperature-Range Chip Packaging Module.

Phase II

Contract Number: ----------
Start Date: ----    Completed: ----
Phase II year
----
Phase II Amount
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