Company Profile

Structured around design, development and manufacture of the industry’s most compact high-speed fiber optic components for harsh environments (HEFO), Ultra Comunications products are built on UltraComm’s patented planar flip-chip packaging platform enabling never before possible -- products that are the smallest in size, the lowest in weight and power (SWaP), are SMT reflow solderable and use the firm's patented removable RVCON connector. Mission Agency involved from soon afetrfirm was founded and steadily for a dozen+ years, Ultra Communications has developed an innovative photonic packaging approach that combines optoelectronic devices (such as VCSELs, PINs) with transceiver ASICs and lenses using flip-chip bonding. The result is an extremely compact, low-cost, and robust component for optical communications.The firm has demonstrated fiber based and free space optical interconnects (board-to-board) with this technology. The arrangement enables the optical measurement of each VCSEL channel through an integrated photodetector, allowing for wide temperature range operation and built-in test functionality.Ultra Communications is currently developing several products, including fiber optic transceivers with integrated OTDR, compact embeddable transceivers, and RF ASICs.UltraComm maintains a 2,000 sq. ft. class 1000 clean room with ESD controls, including humidity. With an automated 8” wafer test system, and automated fiber optic module test station, UltraComm has photonic assembly & test capabilities (50 GHz scopes, 17 Gbps BERTs) on-site. UltraComm also maintains environmental test chambers, including a EPIC thermal cycle/shock camber for stressing optical modules through qualification.