Date: Oct 22, 2013 Source: (
click here to go to the source)
SANTA FE
--
iBeam Materials, Inc., a Santa Fe technology start up and
a
spin off from Los
Alamos National Laboratory
(LANL)
, announ
ced today that
the
Department of Energy
Advanced Research Projects Agency (ARPA
-
E
) has awarded it a research and development
project starting in 2014. The award
of $793,000
is part of the ARPA
-
E
program called
SWITCHES
,
which is short for "Strategies for W
ide
-
Bandgap
,
Inexpensive Transistors for
Controlling High
-
Efficiency Systems." The iBeam project involves research in low
-
cost
substrates for deposition of high
-
performance semiconducting
devices
and
will be done in
collaboration
with Sandia National Labor
atories,
a key partner
in this project.
Dr. Vladimir Matias, Founder and President of iBeam, commenting on the award said,
"This is
very exciting news.
We are
grateful for the funding from ARPA
-
E, which
was made possible by
the support from
our
colleagu
es
at
Los Alamos
and Sandia
.
iBeam
also
wants to thank
New
Mexico Bank & Trust for
their help
in
getting
the business started.
We
can't wait to
get
this
project under way
."
ARPA
-
E announcement can be found here:
http://www.arpa
-
e.energy.gov/?q=arpa
-
e
-
news
-
item/us
-
energy
-
department's
-
arpa
-
e
-
announces
-
27
-
million
-
transformational
-
grid
About iBeam Materials
iBeam Materials, In
c., located in the Agua Fria Business Park in Santa Fe,
currently marks two
years since its founding in
2011. The company specializes in use of
an
ion beam technology
for crystal alignment of thin layers deposited on a variety of substrates and providing f
or
improved performance electronic and energy devices.
Dr. Vladimir
Matias founded iBeam
with the help of an equipment loan from LANL. He worked at LANL for eleven years as a team
and project leader in the superconductivity program
a
n
d his work there was r
ecognized with
two R&D 100 national awards
. Prior to LANL Matias worked at two startups and has physics
degrees
from Stanford University and Caltech.
