High temperature reliability is needed to design distributed power conditioning systems in next generation, high power density SiC and GaN-based electronics. New high energy density capacitors are needed to reduce the volume and weight of power conditioning modules and high temperature reliability is needed to enable, SiC/GaN-based power systems. Ceramics have excellent power handling capability due to their low dissipation factors and relatively high thermal conductivity. The capacitors developed on this Phase I program will have capacitance 500nF ~1F, an energy density up to 4J/cc, working voltage & gt;800V, and a wide working temperature range up to & gt;300C. Pilot scale capacitor production will be developed and capacitors will be assembled into modules for a target capacitance of & gt;10 F for the Phase II program. Other application of high temperature ceramic capacitor with high energy density will include electric power conversion systems on mobile platforms such as hybrid electric ground vehicles, all electric ships, and more electric aircraft with well logging tools for the oil, gas, and geothermal well drilling industries.