SBIR-STTR Award

High Power Pulsed Fiber Laser for EUV Lithography
Award last edited on: 12/28/2023

Sponsored Program
SBIR
Awarding Agency
NSF
Total Award Amount
$633,458
Award Phase
2
Solicitation Topic Code
NM
Principal Investigator
Thomas Sosnowski

Company Information

Arbor Photonics Inc

251 Jackson Plaza Unit A1
Ann Arbor, MI 48103
   (734) 585-5730
   info@arborphotonics.com
   www.arborphotonics.com
Location: Single
Congr. District: 12
County: Washtenaw

Phase I

Contract Number: 0945648
Start Date: 1/1/2010    Completed: 3/31/2011
Phase I year
2009
Phase I Amount
$188,566
This Small Business Innovation Research Phase I project will establish the feasibility of a power scalable, short pulse fiber laser that is suitable for use in Extreme UV Lithography (EUVL). A power scalable solution is proposed here, based on fiber lasers using Chirally-Coupled Core (3C) fiber that is 3X more energy efficient and dramatically more compact than competing alternatives. 3C fiber enables single-mode optical output from fibers with core diameters much larger than conventional double-clad fiber. Successful completion of this project would provide a technology to extend photolithography for feature sizes below 22 nanometers. Currently available laser technology can deliver only one third of the power required for high volume manufacturing by EUVL. Source laser power scaling is a key enabler for high volume manufacturing with EUVL and hence the production of semiconductor integrated circuits (ICs) that are smaller, more powerful and more energy efficient

Phase II

Contract Number: 1058538
Start Date: 4/1/2011    Completed: 3/31/2013
Phase II year
2011
Phase II Amount
$444,892
This Small Business Innovation Research Phase II project has the core objective to develop a modular, laser power scaling concept based on recent innovations in high efficiency fiber lasers. The proposed concept uses large mode area, chirally-coupled core fiber to construct high power, pulsed fiber laser modules that can be spectrally combined into a single, collinear beam delivering multi-kilowatts of average power. Power scaling of a laser source with characteristics appropriate for the generation of extreme ultraviolet (EUV) radiation is a key obstacle to the technical maturity of EUV lithography. EUV lithography is the leading candidate for high volume manufacturing of the next generation of semiconductor integrated circuits with critical dimensions of 22 nm or less. The Phase II effort builds on the successful Phase I feasibility and design results by developing the critical components and constructing a prototype laser module. Results expected from this work include construction and characterization of key laser components capable of withstanding high laser peak powers and demonstration of a breadboard, prototype fiber laser capable of producing pulse energy of 1 millijoule or more with pulse lengths of 5-30 nanoseconds at pulse repetition rates in the range of 50-200 kHz. The broader impact/commercial potential of this project is the continued advancement of semiconductor integrated circuit performance. A key metric in this advancement is the minimum critical dimension that can be realized in the manufacture of these devices. Advances in lithography have enabled a decrease of approximately 30% in this dimension every two years, which has led to a doubling every eighteen months in the number of transistors on an integrated circuit. This trend, known as Moore's Law, has fueled an explosion in the processing power, storage capacity, efficiency and affordability of microelectronic devices. EUV lithography, currently under development, is the critical manufacturing technology that is needed to sustain this trend on the five to ten year horizon. Development of a power scalable laser, operating in the nanosecond pulse regime, is a critical element in the practical realization of EUV lithography. Success in this endeavor will help to deliver continued advances in microelectronic devices that benefit fields of study and industry as diverse as genetic engineering, telecommunications, computer engineering and transportation