ATEC, in collaboration with the Smart and Small Thermal Systems Laboratory at the University of Maryland, proposes the development of low-profile, air-cooled heat sinks for use in cooling electronic modules, such as the Ground Mobile Radio communications systems. These heat sinks will be much smaller than other air-cooled heat sinks because of the very high thermal efficiency of the micro-groove surfaces and a unique manifolding arrangement that minimizes pressure drop.
Keywords: Thermal Management, Micro-Groove Surfaces, Electronic Cooling, Low-Profile Heat Sink, Air-Cooled,
